140SAI94000S模塊
工作溫度范圍為-25℃ to 70℃，無論是在高溫還是低溫環(huán)境下，都能實(shí)現(xiàn)出色的高效率，適用于充電樁安裝、運(yùn)行在戶外，其一年四季溫差較大的應(yīng)用條件；
器件滿足浪涌及脈沖群4級要求，充電樁通常在復(fù)雜的環(huán)境下運(yùn)行，受到較為強(qiáng)烈的電磁干擾，其主電源必須擁有優(yōu)質(zhì)的EMC性能以滿足抵抗復(fù)雜的應(yīng)用環(huán)境干擾。
140SAI94000S模塊除滿足有序充電系統(tǒng)應(yīng)用的同時(shí)，還進(jìn)一步簡化系統(tǒng)設(shè)計(jì)，降低了系統(tǒng)整體成本并提升系統(tǒng)可靠性交流樁“有序充電”作為未來主流之一將會大力發(fā)展，金升陽緊跟時(shí)代潮流，開發(fā)交流充電樁專用電源產(chǎn)品，解決市場所需、客戶所求。同時(shí)，Mornsun的研發(fā)團(tuán)隊(duì)已擴(kuò)充至500+人，擁有CE/UL/CSA/CB等多個(gè)目擊實(shí)驗(yàn)室，針對充電樁行業(yè)新的市場需求，能夠迅速響應(yīng)，開發(fā)出對應(yīng)需求的行業(yè)電源。能源管理系統(tǒng)、電力監(jiān)控系統(tǒng)的需求也日益增加。突發(fā)斷電不僅會推高電子設(shè)備的維護(hù)成本，也會降低操作效率和生產(chǎn)力，影響企業(yè)整體收益。為確保穩(wěn)定的電源供應(yīng)，您需要實(shí)時(shí)監(jiān)控工業(yè)應(yīng)用的電能質(zhì)量，以防電子設(shè)備因異常電流波動受到干擾或損壞。
開關(guān)柜和不間斷電源 (UPS)的監(jiān)控是能源管理系統(tǒng)的兩個(gè)關(guān)鍵要素。一般而言，開關(guān)柜是公共電能進(jìn)入工廠電網(wǎng)和數(shù)據(jù)中心的第一站。開關(guān)柜主要用于轉(zhuǎn)換電壓、監(jiān)測電流電壓，還能保護(hù)工業(yè)設(shè)備避免受到電力異常波動的影響。您需要實(shí)時(shí)監(jiān)控開關(guān)柜內(nèi)安裝的斷路器、浪涌保護(hù)器、電流電壓表和電能質(zhì)量表。此外，當(dāng)主電源斷電且備用電源（如發(fā)電機(jī)）無法及時(shí)到位時(shí)，USP 需要確保供電不中斷。開關(guān)柜和 UPS 需連接能源管理系統(tǒng) (EMS)，才能實(shí)時(shí)監(jiān)控電力質(zhì)量狀態(tài)，幫助運(yùn)維人員快速作出決定，盡可能減少系統(tǒng)停機(jī)。同時(shí)，還需在上述三者間部署可靠的通信系統(tǒng)，來監(jiān)控電力質(zhì)量，并及時(shí)對緊急情況采取措施。如何在電力質(zhì)量監(jiān)控應(yīng)用中部署通信系統(tǒng)？我們?yōu)槟峁┤缦氯齻€(gè)小技巧。
首先，通信系統(tǒng)需要具備高 EMI 抵抗力。為實(shí)時(shí)接收底層設(shè)備的電力質(zhì)量狀態(tài)，用于監(jiān)控電力質(zhì)量的通信系統(tǒng)也需具備高電磁保護(hù)手段。通信設(shè)備通常位于電力系統(tǒng)附近，后者產(chǎn)生的高 EMI 極易干擾網(wǎng)絡(luò)通信。
the origin position to the wafer suction position. The wafer is placed on the expander wafer disc supported by the film. After the bonding arm is in place, the suction nozzle moves downward, the thimble moves upward to jack up the wafer, and after picking up the wafer, the bonding arm returns to the origin position, The bonding arm then moves from the origin position to the bonding position. After the suction nozzle bonds the wafer downward, the bonding arm returns to the origin position again. This is a complete bonding process. When a beat operation is completed, the data of the next position of the wafer is detected by machine vision, and the data is transmitted to the wafer disc motor. After the motor has completed the corresponding distance, the next wafer is moved to the aligned wafer picking position. The dispensing and bonding position of PCB board is the same process until all the dispensing positions on PCB board are bonded, and then the PCB board is removed from the workbench by the transmission mechanism, and a new PCB board is installed to start a new work cycle.
System advantages
The motion control part of the LED solid crystal machine system is realized by servo motor and stepping motor.
