LAM 10-800081-022 CPU主板 PDF資料
1.產(chǎn) 品 資 料 介 紹：
中文資料：
LAM 810-800081-022 是一款用于高性能計算和工業(yè)應(yīng)用的 CPU 主板。此主板通常用于需要高處理能力、穩(wěn)定性和擴展性的系統(tǒng)中。具體來說，這款主板具備以下一些關(guān)鍵特點和應(yīng)用領(lǐng)域：
主要特點：
處理器支持：
- 該主板支持高性能的處理器，如 Intel 或 AMD 系列處理器，具體支持的處理器型號取決于主板的設(shè)計和市場需求。
- 具備強大的多核處理能力，適合用于并行計算或多任務(wù)處理的應(yīng)用。
擴展性：
- 支持多種擴展接口，如 PCIe 插槽、USB、SATA、LAN 等接口，提供高度的擴展能力。
- 可支持多種外設(shè)和附加卡，如圖形卡、網(wǎng)絡(luò)適配器等。
內(nèi)存支持：
- 支持 DDR4 或更高版本的內(nèi)存，具有較大的內(nèi)存容量，適合大規(guī)模數(shù)據(jù)處理和內(nèi)存密集型應(yīng)用。
存儲和網(wǎng)絡(luò)接口：
- 配備多個 SATA 和 NVMe 接口，支持 SSD 或 HDD 存儲設(shè)備。
- 集成或支持多個網(wǎng)絡(luò)接口（如 1G/10G Ethernet），適用于數(shù)據(jù)中心、服務(wù)器或高性能計算集群。
電源管理：
- 具有高效的電源管理系統(tǒng)，確保穩(wěn)定的電力供應(yīng)，尤其在高負(fù)載情況下能夠維持系統(tǒng)的穩(wěn)定運行。
散熱設(shè)計：
- 配有高效的散熱系統(tǒng)，包括風(fēng)扇和散熱片，保證主板在高負(fù)載運行時保持較低溫度，避免過熱。
可靠性和耐用性：
- 采用工業(yè)級組件，具有較高的耐用性，適合在惡劣環(huán)境下使用。
- 高穩(wěn)定性設(shè)計，特別適用于關(guān)鍵任務(wù)和長期運行的系統(tǒng)。
英文資料：
LAM 810-800081-022 is a CPU motherboard designed for high-performance computing and industrial applications. This motherboard is typically used in systems that require high processing power, stability, and scalability. Specifically, this motherboard has the following key features and application areas:
Main features:
Processor support:
This motherboard supports high-performance processors, such as Intel or AMD series processors, and the specific supported processor models depend on the design of the motherboard and market demand.
Capable of powerful multi-core processing, suitable for applications involving parallel computing or multitasking.
Scalability:
Supports multiple expansion interfaces, such as PCIe slots, USB, SATA, LAN, etc., providing high expansion capability.
It can support various peripherals and additional cards, such as graphics cards, network adapters, etc.
Memory support:
Supports DDR4 or higher versions of memory, with large memory capacity, suitable for large-scale data processing and memory intensive applications.
Storage and network interfaces:
Equipped with multiple SATA and NVMe interfaces, supporting SSD or HDD storage devices.
Integrate or support multiple network interfaces (such as 1G/10G Ethernet), suitable for data centers, servers, or high-performance computing clusters.
Power management:
Equipped with an efficient power management system to ensure stable power supply, especially in high load situations, the system can maintain stable operation.
Heat dissipation design:
Equipped with an efficient cooling system, including fans and heat sinks, to ensure that the motherboard maintains a low temperature during high load operation and avoid overheating.
Reliability and Durability:
Using industrial grade components, it has high durability and is suitable for use in harsh environments.
High stability design, especially suitable for critical tasks and long-term operating systems.
2.產(chǎn) 品 展 示
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