APPLIED MATERIALS 0010-44213晶圓提升組件 PDF資料
1.產(chǎn) 品 資 料 介 紹：
中文資料：
Applied Materials 0010-44213 晶圓提升組件 是半導體設備中的關(guān)鍵組件，用于支持晶圓的搬運、提升和精確定位。這種組件通常應用于晶圓處理系統(tǒng)，如化學氣相沉積（CVD）、物理氣相沉積（PVD）、離子注入以及蝕刻設備中，確保晶圓在加工過程中的高精度和穩(wěn)定性。
產(chǎn)品概述
- 型號：0010-44213
- 品牌：Applied Materials
- 產(chǎn)品類型：晶圓提升組件
- 主要功能：實現(xiàn)晶圓在半導體設備內(nèi)部的穩(wěn)定提升、搬運和位置調(diào)整，支持精準工藝操作。
主要特點
高精度控制：
- 支持亞微米級精度，確保晶圓定位的可靠性。
- 減少晶圓在提升或移動過程中的偏移和損傷。
耐用材料：
- 使用高強度、低摩擦材料制造，耐高溫、耐腐蝕，適用于苛刻的半導體加工環(huán)境。
- 延長組件使用壽命，降低維護成本。
穩(wěn)定性強：
- 專為高頻率使用設計，提供平穩(wěn)的提升和下降運動。
- 適用于多種尺寸晶圓（通常支持 200mm 和 300mm 晶圓）。
模塊化設計：
- 便于集成到多種 Applied Materials 的半導體設備中。
- 支持快速更換和維護，減少設備停機時間。
兼容性強：
- 與 Applied Materials 的各類晶圓處理設備兼容，如 Etch、PVD、CVD 系統(tǒng)等。
技術(shù)參數(shù)
- 支持晶圓尺寸：200mm 或 300mm 晶圓（具體視型號和配置而定）。
- 操作環(huán)境：
- 溫度范圍：耐高溫環(huán)境，通常在 150°C - 450°C 之間工作。
- 真空兼容性：支持高真空條件下運行。
- 材料：抗熱沖擊陶瓷或特種合金，表面經(jīng)過特殊涂層處理，減少顆粒生成。
- 動作控制：支持線性提升或旋轉(zhuǎn)運動，具體取決于設備配置。
應用場景
晶圓搬運：
- 支持從傳送裝置到工藝腔體的晶圓轉(zhuǎn)移，確保高效、精準的處理流程。
晶圓加工：
- 在蝕刻、薄膜沉積、氧化等工藝中，將晶圓提升至工藝位置并保持穩(wěn)定。
自動化晶圓生產(chǎn)線：
- 用于支持全自動化晶圓生產(chǎn)線的運輸和處理系統(tǒng)，提升生產(chǎn)效率。
優(yōu)勢
- 高可靠性：設計用于長期高負荷運行，性能穩(wěn)定且維護需求低。
- 易集成性：與 Applied Materials 的主流設備完美兼容，安裝和使用方便。
- 低污染風險：優(yōu)化的材料和設計減少顆粒污染風險，確保高良率晶圓加工。
英文資料：
The Applied Materials 0010-44213 wafer lift module is a critical component in semiconductor equipment, used to support wafer handling, lifting, and precise positioning. This type of component is commonly used in wafer processing systems such as chemical vapor deposition (CVD), physical vapor deposition (PVD), ion implantation, and etching equipment to ensure high precision and stability of the wafer during processing.
Product Overview
Model: 0010-44213
Brand: Applied Materials
Product type: Wafer lifting component
Main function: To achieve stable lifting, handling, and position adjustment of wafers inside semiconductor equipment, supporting precise process operations.
main features
High precision control:
Support sub micron level accuracy to ensure the reliability of wafer positioning.
Reduce the offset and damage of wafers during lifting or movement.
Durable materials:
Made of high-strength, low friction materials, resistant to high temperatures and corrosion, suitable for harsh semiconductor processing environments.
Extend the service life of components and reduce maintenance costs.
Strong stability:
Specially designed for high-frequency use, providing smooth lifting and lowering movements.
Suitable for various sizes of wafers (usually supporting 200mm and 300mm wafers).
Modular design:
Easy to integrate into semiconductor devices of various Applied Materials.
Support quick replacement and maintenance, reducing equipment downtime.
Strong compatibility:
Compatible with various wafer processing equipment from Applied Materials, such as Etch, PVD, CVD systems, etc.
technical parameter
Supporting wafer size: 200mm or 300mm wafers (depending on model and configuration).
Operating environment:
Temperature range: Resistant to high temperature environments, typically operating between 150 ° C and 450 ° C.
Vacuum compatibility: Supports operation under high vacuum conditions.
Material: Heat shock resistant ceramic or special alloy, surface treated with special coating to reduce particle formation.
Action control: Supports linear lifting or rotational motion, depending on device configuration.
Application scenarios
Wafer handling:
Support wafer transfer from the transfer device to the process chamber, ensuring efficient and precise processing flow.
Wafer processing:
In processes such as etching, thin film deposition, and oxidation, raise the wafer to the process position and maintain stability.
Automated wafer production line:
Used to support the transportation and processing system of fully automated wafer production lines, improving production efficiency.
advantage
High reliability: designed for long-term high load operation, with stable performance and low maintenance requirements.
Easy integration: Perfectly compatible with mainstream equipment from Applied Materials, easy to install and use.
Low pollution risk: Optimized materials and designs reduce the risk of particle contamination, ensuring high yield wafer processing.
2.產(chǎn) 品 展 示
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