Brooks 02-169208-00晶圓處理機器人 PDF資料
1.產(chǎn) 品 資 料 介 紹:
中文資料:
Brooks 02-169208-00 晶圓處理機器人 是Brooks Automation公司專為半導(dǎo)體制造和晶圓處理設(shè)計的自動化機器人。這款機器人用于在晶圓處理流程中完成精確的搬運、定位和傳輸,適用于無塵室等高潔凈度環(huán)境。其可靠的設(shè)計、精準的控制系統(tǒng)和高效的搬運能力,使其成為半導(dǎo)體生產(chǎn)和檢測工藝中的重要工具。
主要特點:
高精度搬運:
- Brooks 02-169208-00 機器人能夠?qū)崿F(xiàn)微米級的晶圓定位,保證晶圓在傳輸過程中的精確度。其高精度設(shè)計適應(yīng)了半導(dǎo)體制造中極小誤差容忍度的需求。
- 其控制系統(tǒng)提供了平滑穩(wěn)定的運動路徑,從而減少搬運過程中對晶圓的振動,降低晶圓破損的風險。
多軸控制與靈活操作:
- 配備多軸控制系統(tǒng),支持多方向、多角度的自由運動。機器人能夠輕松進行平移、旋轉(zhuǎn)、傾斜等復(fù)雜運動,以適應(yīng)各類設(shè)備的不同進出口需求。
- 靈活的設(shè)計使其能夠在狹小或復(fù)雜的設(shè)備布置中自如運作,增加生產(chǎn)線布置的多樣性。
高速搬運能力:
- 該機器人能夠以較快的速度完成晶圓搬運,優(yōu)化了工藝步驟之間的傳輸時間,從而提高了整個生產(chǎn)線的效率。其快速響應(yīng)系統(tǒng)確保在保持精度的前提下,實現(xiàn)高速傳輸。
潔凈室兼容設(shè)計:
- Brooks 02-169208-00 的材質(zhì)和結(jié)構(gòu)設(shè)計符合潔凈室的嚴格標準,具有低顆粒生成和低污染風險,適合在潔凈室環(huán)境中長時間穩(wěn)定運行,保護晶圓免受污染。
- 防塵設(shè)計以及高耐用性材料使其能夠在潔凈室中運作,并最大限度減少對環(huán)境的干擾。
智能監(jiān)控與自我診斷:
- 配有智能化監(jiān)控系統(tǒng),可實時監(jiān)測搬運和操作狀態(tài),并提供故障檢測和診斷功能。該自診斷功能能夠幫助運維團隊及時發(fā)現(xiàn)并解決問題,降低意外停機的風險。
- 支持與上位機連接,能夠?qū)\行狀態(tài)、性能指標等進行數(shù)據(jù)分析和記錄,幫助優(yōu)化生產(chǎn)效率。
模塊化設(shè)計:
- 設(shè)計上具有模塊化結(jié)構(gòu),便于與其他Brooks設(shè)備或第三方晶圓處理設(shè)備集成。模塊化設(shè)計便于擴展、升級和維護,為生產(chǎn)線的柔性化提供了支持。
- 該特性使其能夠根據(jù)特定需求進行配置和調(diào)整,以滿足不同晶圓尺寸或工藝流程的要求。
英文資料:
The Brooks 02-169208-00 wafer processing robot is an automated robot designed by Brooks Automation specifically for semiconductor manufacturing and wafer processing. This robot is used for precise handling, positioning, and transportation in wafer processing processes, and is suitable for high cleanliness environments such as cleanrooms. Its reliable design, precise control system, and efficient handling capability make it an important tool in semiconductor production and testing processes.
Main features:
High precision handling:
The Brooks 02-169208-00 robot is capable of achieving micrometer level wafer positioning, ensuring the accuracy of the wafer during transportation. Its high-precision design meets the demand for minimal error tolerance in semiconductor manufacturing.
Its control system provides a smooth and stable motion path, thereby reducing the vibration of the wafer during transportation and lowering the risk of wafer damage.
Multi axis control and flexible operation:
Equipped with a multi axis control system, supporting free movement in multiple directions and angles. Robots can easily perform complex movements such as translation, rotation, and tilt to meet the different import and export needs of various devices.
The flexible design enables it to operate freely in small or complex equipment arrangements, increasing the diversity of production line layouts.
High speed handling capacity:
This robot is able to complete wafer handling at a faster speed, optimizing the transfer time between process steps and thus improving the efficiency of the entire production line. Its rapid response system ensures high-speed transmission while maintaining accuracy.
Cleanroom compatible design:
The material and structural design of Brooks 02-169208-00 meet the strict standards of cleanrooms, with low particle generation and low contamination risk, suitable for long-term stable operation in cleanroom environments, and protecting wafers from contamination.
The dust-proof design and high durability materials enable it to operate in clean rooms and minimize interference with the environment.
Intelligent monitoring and self diagnosis:
Equipped with an intelligent monitoring system, it can monitor the handling and operation status in real time, and provide fault detection and diagnosis functions. This self diagnostic function can help the operations team discover and solve problems in a timely manner, reducing the risk of unexpected downtime.
Support connection with the upper computer, capable of analyzing and recording data on operating status, performance indicators, etc., to help optimize production efficiency.
Modular design:
Designed with a modular structure, it is easy to integrate with other Brooks equipment or third-party wafer processing equipment. Modular design facilitates expansion, upgrading, and maintenance, providing support for the flexibility of production lines.
This feature enables it to be configured and adjusted according to specific needs to meet the requirements of different wafer sizes or process flows.
2.產(chǎn) 品 展 示
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PMB31B-10214-01 | IEFAN01 | 57160001-ADF DSDP 170 |
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PMB31B-10201-01 | INTKM01 | XV 7715b |
PMB31B-10201-00 | 07ZE63R302 | P22NRXA-LNF-NS-00 |
PMB31B-10200-03 | AMAT 0100-01488 | 57160001-TZ DSTD 110 |
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