Brooks 002-7090-11 晶圓傳輸機(jī)器人 PDF資料
1.產(chǎn) 品 資 料 介 紹：
中文資料：
Brooks 002-7090-11 晶圓傳輸機(jī)器人 是Brooks Automation公司專(zhuān)為半導(dǎo)體和電子制造業(yè)設(shè)計(jì)的一款高性能晶圓搬運(yùn)機(jī)器人。該機(jī)器人用于在不同工藝設(shè)備之間搬運(yùn)晶圓，幫助實(shí)現(xiàn)生產(chǎn)流程的自動(dòng)化、精準(zhǔn)化和高效化。它廣泛應(yīng)用于半導(dǎo)體制造中的多個(gè)環(huán)節(jié)，如晶圓清洗、蝕刻、涂層、曝光和檢測(cè)等工藝步驟。
主要特點(diǎn)：
高精度定位與搬運(yùn)：
- Brooks 002-7090-11 機(jī)器人采用先進(jìn)的定位技術(shù)，能夠?qū)崿F(xiàn)亞微米級(jí)的定位精度，確保晶圓在傳輸過(guò)程中的位置準(zhǔn)確無(wú)誤。
- 其搬運(yùn)系統(tǒng)經(jīng)過(guò)優(yōu)化，可以在高速度下維持穩(wěn)定性，降低晶圓傳輸過(guò)程中的振動(dòng)，減少對(duì)晶圓表面的潛在損傷。
多自由度運(yùn)動(dòng)控制：
- 配備多軸、多自由度控制系統(tǒng)，能夠在不同的平面上移動(dòng)和旋轉(zhuǎn)晶圓，滿(mǎn)足復(fù)雜工藝對(duì)位置和角度的精確要求。這一功能尤其適合需要調(diào)整晶圓朝向或高度的工藝步驟。
潔凈室兼容性：
- 設(shè)計(jì)符合半導(dǎo)體行業(yè)的潔凈室標(biāo)準(zhǔn)，具有低顆粒排放特性，能夠在超凈環(huán)境中長(zhǎng)期穩(wěn)定運(yùn)行，避免對(duì)晶圓表面造成污染。
- 材質(zhì)和設(shè)計(jì)都經(jīng)過(guò)優(yōu)化，可在潔凈室的高要求環(huán)境下運(yùn)行，同時(shí)降低維護(hù)需求。
高速傳輸能力：
- Brooks 002-7090-11 機(jī)器人在保持精度的同時(shí)具有快速搬運(yùn)能力，有助于縮短工藝設(shè)備之間的傳輸時(shí)間，從而提高生產(chǎn)效率。
- 支持連續(xù)搬運(yùn)多個(gè)晶圓，適合高產(chǎn)量的生產(chǎn)線(xiàn)，優(yōu)化了制造流程的整體速度。
模塊化設(shè)計(jì)與靈活性：
- 采用模塊化設(shè)計(jì)，能夠輕松集成到不同的自動(dòng)化設(shè)備或生產(chǎn)線(xiàn)中，適應(yīng)性強(qiáng)。用戶(hù)可以根據(jù)生產(chǎn)需求靈活配置，便于擴(kuò)展和升級(jí)。
- 支持與其他Brooks設(shè)備以及第三方控制系統(tǒng)的集成，確保整個(gè)自動(dòng)化系統(tǒng)的兼容性和一致性。
智能化控制與反饋系統(tǒng)：
- 配備智能控制系統(tǒng)，支持實(shí)時(shí)監(jiān)控和位置調(diào)整，能夠根據(jù)晶圓位置自動(dòng)校正，確保搬運(yùn)過(guò)程的穩(wěn)定和準(zhǔn)確。
- 具備自診斷功能，能夠檢測(cè)并反饋?zhàn)陨磉\(yùn)行狀態(tài)，降低停機(jī)時(shí)間，便于運(yùn)維人員及時(shí)響應(yīng)。
英文資料：
The Brooks 002-7090-11 wafer transfer robot is a high-performance wafer handling robot designed by Brooks Automation specifically for the semiconductor and electronic manufacturing industries. This robot is used to transport wafers between different process equipment, helping to achieve automation, precision, and efficiency in the production process. It is widely used in multiple stages of semiconductor manufacturing, such as wafer cleaning, etching, coating, exposure, and inspection processes.
Main features:
High precision positioning and handling:
The Brooks 002-7090-11 robot adopts advanced positioning technology, which can achieve sub micron level positioning accuracy and ensure accurate positioning of wafers during transportation.
The handling system has been optimized to maintain stability at high speeds, reduce vibration during wafer transport, and minimize potential damage to the wafer surface.
Multi degree of freedom motion control:
Equipped with a multi axis and multi degree of freedom control system, the wafer can be moved and rotated on different planes to meet the precise requirements of complex processes for position and angle. This feature is particularly suitable for process steps that require adjusting wafer orientation or height.
Cleanroom compatibility:
Designed to meet the cleanroom standards of the semiconductor industry, with low particle emission characteristics, capable of long-term stable operation in ultra clean environments, and avoiding contamination of wafer surfaces.
The material and design have been optimized to operate in high demand environments in clean rooms while reducing maintenance requirements.
High speed transmission capability:
The Brooks 002-7090-11 robot has fast handling capabilities while maintaining accuracy, which helps shorten the transfer time between process equipment and improve production efficiency.
Supports continuous handling of multiple wafers, suitable for high-yield production lines, optimizing the overall speed of the manufacturing process.
Modular design and flexibility:
Adopting modular design, it can be easily integrated into different automation equipment or production lines, with strong adaptability. Users can flexibly configure according to production needs, making it easy to expand and upgrade.
Support integration with other Brooks devices and third-party control systems to ensure compatibility and consistency of the entire automation system.
Intelligent control and feedback system:
Equipped with an intelligent control system that supports real-time monitoring and position adjustment, it can automatically correct the wafer position to ensure stability and accuracy during the handling process.
Equipped with self diagnostic function, it can detect and provide feedback on its own operating status, reduce downtime, and facilitate timely response by operation and maintenance personnel.
2.產(chǎn) 品 展 示
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5.更多庫(kù)存型號(hào)
| PMB31B-20101-03 | NKMF02-02 | M22NRXC-LDN-NS-00 |
| PMB31B-20101-02 | AMAT 0100-09210 | 57160001-UH DSTD 150 |
| PMB31B-20101-01 | AMAT 0100-20265 | PFRL 101C |
| PMB31B-20101-00 | 07KT93 | P21NSXS-LSS-NS-06 |
| PMB31B-20100-03 | AMAT 0120-93660 | 57160001-PK DSDI 125 |
| PMB31B-20100-02 | PHARPS32000000 | M22NSXB-IDS-NS-02 |
| PMB31B-20100-01 | GJR5250000R0202 | N41HRFL-LNK-NS-00 |
| PMB31B-20100-00 | DOT100 | 57160001-ACX DSDP 140B |
| PMB31B-10216-03 | 07ZE88 | P22NRXA-LDN-HD-00 |
| PMB31B-10216-02 | 07YS80 | P21NRXA-LSS-NS-00 |
| PMB31B-10216-01 | AMAT 0090-A8211 | PXUB201 |
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