Brooks Automation 002-7391-25晶圓對準器 PDF資料
1.產 品 資 料 介 紹：
中文資料：
Brooks Automation 002-7391-25 晶圓對準器是一種高精度的設備，主要用于半導體制造和材料科學領域，確保晶圓在加工過程中的精確對位。該對準器能夠顯著提高晶圓加工的效率和質量，特別是在需要高精度對準的應用中。
主要特點：
高精度對準：
- 具備高精度的光學和機械對準系統，確保晶圓在處理過程中的準確定位，降低位置誤差。
快速響應：
- 設計優化，提供快速的對準速度，能夠在短時間內完成對準過程，提高生產效率。
用戶友好界面：
- 提供直觀的操作界面，使用戶可以方便地設置和調整對準參數，簡化了操作流程。
耐用材料：
- 采用高耐磨和耐腐蝕的材料，確保設備在嚴苛的工業環境中長期穩定運行。
兼容性強：
- 可與多種自動化設備和控制系統兼容，方便集成到現有生產線中。
實時監控：
- 具備實時監控和數據記錄功能，用戶可以隨時查看對準狀態和歷史數據，有助于質量控制。
應用領域：
半導體制造：
- 在晶圓加工過程中，確保晶圓的精確對位，是提升良率和產品質量的關鍵環節。
材料科學研究：
- 用于材料科學實驗中的樣品對準，幫助科學家進行高精度實驗。
光刻工藝：
- 在光刻過程中，對晶圓進行準確對準，以確保圖形的精確轉移。
電子組件組裝：
- 在電子產品組裝過程中，進行元件和基板的對準，以提高組裝的精度和效率。
英文資料：
The Brooks Automation 002-7391-25 wafer aligner is a high-precision device primarily used in semiconductor manufacturing and materials science to ensure precise alignment of wafers during processing. This aligner can significantly improve the efficiency and quality of wafer processing, especially in applications that require high-precision alignment.
Main features:
High precision alignment:
Equipped with high-precision optical and mechanical alignment systems, ensuring accurate positioning of wafers during processing and reducing positional errors.
Quick response:
Design optimization, providing fast alignment speed, can complete the alignment process in a short time, and improve production efficiency.
User friendly interface:
Providing an intuitive user interface allows users to easily set and adjust alignment parameters, simplifying the operation process.
Durable materials:
Using highly wear-resistant and corrosion-resistant materials to ensure long-term stable operation of the equipment in harsh industrial environments.
Strong compatibility:
Compatible with various automation equipment and control systems, making it easy to integrate into existing production lines.
Real time monitoring:
Equipped with real-time monitoring and data recording functions, users can view alignment status and historical data at any time, which helps with quality control.
Application areas:
Semiconductor manufacturing:
Ensuring precise alignment of wafers during wafer processing is a key step in improving yield and product quality.
Materials Science Research:
Used for sample alignment in materials science experiments, helping scientists conduct high-precision experiments.
Lithography process:
During the photolithography process, the wafer is accurately aligned to ensure precise transfer of patterns.
Electronic component assembly:
During the assembly process of electronic products, alignment of components and substrates is carried out to improve the accuracy and efficiency of assembly.
2.產 品 展 示
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4.其他英文產品
ASEA 57360001-AN circuit board
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5.更多庫存型號
| PMB31D-10114-03 | NKMP11 | M22NRXB-LNN-NS-02 |
| PMB31D-10114-02 | AMAT 0100-13011 | 57160001-LF DSTD 133 |
| PMB31D-10114-01 | 70 FA 01b | PWM3636-5486-7 |
| PMB31D-10114-00 | IIMCL01 | 57160001-FH DSTD 170 |
| PMB31D-10101-03 | 70 BL 02C | N42HRFM-LNK-NS-00 |
| PMB31D-10101-02 | AMAT 0100-09136 | 57120001-HP DSTA 145 |
| PMB31D-10101-01 | 07YS81 | P21NSXC-LNN-NS-04 |
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